The Union Cabinet, chaired by Prime Minister Shri Narendra Modi, approved four new semiconductor manufacturing projects under the India Semiconductor Mission (ISM), the Ministry of Electronics and Information Technology (MeitY) announced today in an official release.
Approval of Four New Projects These four proposals—from SiCSem, Continental Device India Limited (CDIL), 3D Glass Solutions Inc., and Advanced System in Package (ASIP) Technologies—will involve a combined investment of approximately Rs. 4,600 crore, according to the release, which stated that with six projects already underway.
The projects are anticipated to spur additional indirect job creation in the electronics manufacturing sector and employ approximately 2,034 skilled professionals. Demand for semiconductors propels ISM projects to 10 With this addition, the total number of ISM projects that have been approved now stands at ten, with an estimated Rs. 1.60 lakh crore in six states, according to the release. The Ministry emphasized the significance of these projects to the advancement of Atmanirbhar Bharat, pointing to the rising demand for semiconductors in the telecom, automotive, data center, consumer electronics, and industrial sectors. Overview and Locations of the Project The following three states will host the new semiconductor projects, according to the official announcement: SiCSem Project in Odisha
India’s first commercial SiC semiconductor fab is being established at Info Valley, Bhubaneswar, by SiCSem Private Limited and Clas-SiC Wafer Fab Ltd., both of which are based in the United Kingdom. Each year, the facility will process 60,000 wafers and package 96 million of them for use in defense, electric vehicles, trains, chargers, data centers, appliances, and solar inverters. Odisha’s 3D Glass Solutions Project In Bhubaneswar’s Info Valley, 3D Glass Solutions Inc. will open a manufacturing facility that will specialize in embedded glass substrates and cutting-edge semiconductor packaging. Using technologies like glass interposers, silicon bridges, and 3DHI modules, the plant will produce 69,600 glass panels, 50 million units, and 13,200 3DHI modules annually for defense, AI, RF, automotive, and photonics applications.
Project ASIP Technologies in Andhra Pradesh by way of a technology partnership with APACT Co. Ltd. A semiconductor manufacturing facility will be established in Andhra Pradesh by ASIP Technologies (South Korea). With an annual output of 96 million units, the plant will serve mobile, automotive, and consumer electronics markets.
Punjab CDIL expansion Using silicon and SiC technologies, Continental Device India Limited (CDIL) is expanding its semiconductor plant in Mohali, Punjab, to produce high-power discrete devices like MOSFETs, IGBTs, Schottky diodes, and transistors. 158.38 million units for electric vehicles, renewable energy, industrial systems, and communications will be produced annually at the upgraded plant. Enhancing the Ecosystem of Semiconductors These projects, which strengthen India’s semiconductor capabilities, include India’s first commercial compound semiconductor fab and an advanced glass substrate packaging unit, according to the Ministry’s press release. These initiatives add to the development of chip design infrastructure supported by the government at 278 academic institutions and 72 startups. The release also said that over 60,000 students have benefited from talent development programs designed to create skilled semiconductor workers.
